Outperforms alternative networks with 30% higher HPC application performance, 2X greater message rates, and 6X faster AI collective communication “Networking should do more than just move data quickly ...

Cadence 112G-LR SerDes silicon proven in GUC’s HBM3/GLink/CoWoS platform SAN JOSE, Calif.--(BUSINESS WIRE)-- Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 112G-LR ...

Cornelis, a leading provider of intelligent networking solutions for AI and high performance computing (HPC), and xFusion, a global provider of computing infrastructure and services, announced a ...

High-performance computing (HPC) aggregates multiple servers into a cluster that is designed to process large amounts of data at high speeds to solve complex problems. HPC is particularly well suited ...

Cornelis is expanding its global partner ecosystem with new federal integrators and distributors to accelerate deployment of CN5000 high-performance networking solutions for AI and HPC environments.

Forward-looking: Ultra Ethernet means to deliver a comprehensive architecture that optimizes Ethernet for high performance in AI and HPC networking, surpassing the capabilities of today's specialized ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that the GLink-3D interface (GUC's Link for 3D die stacking) for the TSMC 3DFabric SoIC-X 3D stacking platform passed ...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP on TSMC's N5 process ...