Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...
Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...
AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...
Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...
An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.
A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.
Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...
Researchers from Georgia Institute of Technology published a technical paper titled “Open DRAM Model—Part II: Enabling ...
Every generation of AI infrastructure has redefined what “the network” means. In today’s training clusters — scaling from hundreds to hundreds of thousands of accelerators — the interconnect is no ...
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