Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

Intel's expansion; Cadence AI super agent for PCB, advanced packaging; photonics fab wars; earlier Yongin fab; German funding ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...

Investors kept pouring money into AI hardware startups in the second quarter of 2026. While companies focused on chips for AI data centers have largely dominated the funding over the past year, ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and ...

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

If one AI agent can solve a problem in a certain amount of time, can multiple agents solve it faster? The answer is yes, but only if the agents have well-defined roles and targets. This is where ...

Key Takeaways: There is no single processor capable of executing everything efficiently, meaning that multiple processors are required. Maximum efficiency is gained by minimizing the movement of data.

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...