This app note provides guidelines for SMT assembly of Amkor's DRMLF® packages using prevalent practices in the SMT industry and standards such as IPC and JEDEC.

At the 2026 IEEE Electronic Components and Technology Conference (ECTC), imec, a world-leading research and innovation hub in advanced semiconductor technologies ... EV Group (EVG) announced that it ...

This study demonstrates that molded flip chip BGA packages with optimized EMC materials and process parameters achieve superior warpage control and reliability performance compared to conventional ...

This white paper advocates for Package Assembly Design Kits (PADK) to streamline high-density fan-out package design by integrating manufacturing verification early, reducing design cycles and ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. This paper explores how, with chips becoming smaller ...

CEA Leti reaffirmed its long standing collaboration with GlobalFoundries (GF), whose ongoing participation in the FAMES Pilot Line as an end user is advancing more than two ... Semiconductor Packaging ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. This paper explores how, with chips becoming smaller ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it.

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. This paper explores how, with chips becoming smaller ...

Semiconductor Packaging News is built for professionals who bear the responsibility of looking ahead, imagining the future, and preparing for it. These new Board to Board Connectors feature pitch ...

The study highlights High-Density Fan-Out (HDFO) packages' fine copper redistribution layer (Cu RDL) reliability under electromigration (EM). Findings include distinct failure modes, resistance ...

Nettrix has been accused of selling computer servers with Intel and Nvidia chips to sanctioned Chinese entities. Established in 2019 by ex-Sugon executives, Nettrix allegedly supplied products to ...