Chipmaking equipment giant Applied Materials Inc. is trying to make life easier for its chip fabrication plant customers, so they can build the extremely complex 3D architectures necessary for the ...

Abstract: The emerging era of 3D Heterogeneous Integration (3DHI) in Advanced Packages and Wafer level packaging of ICs introduce significant challenges for inline defect inspection and offline ...

Abstract: Augmented Reality (AR) integration via handheld devices is a subject of significant interest for mobile applications and interactions between humans and machines. The mobile AR technique ...