AI-driven compute demands have led to several distinct supply chain bottlenecks for data centers. Legacy power management ...

Hybrid bonding already works in production, but finer-pitch die-to-wafer integration must preserve fab-level surface and ...

A realistic virtual model uncovers the impact of rounded corners on sensitivity to overlay-induced resistance.

Newer nonvolatile memory (NVM) technologies are poised to take over from flash in embedded applications on newer process ...

An Industry 4.0 technology roadmap for semiconductor device makers that covers carbon emissions, water, and hazardous waste.

Hybrid bonding is essential for the interconnect density that high-bandwidth workloads require. Successful implementation depends on control of surface chemistry and surface topography — clean ...

AI opens the door to exploring a much larger solution space, similar to what high-level synthesis did years ago, but ...