Our team designed and built a fully functional prototype from the ground up. We handled the firmware, the PCB layout, the 3D ...

"Where did my pet go?" If you have a pet, you've probably asked this question at least once. One moment they're playing ...

Abstract: The parasitic inductance and dynamic current sharing performances of multichip silicon carbide power module packaging limit the device's performance. Moreover, high electrical properties ...

Abstract: 2.5D silicon interposer packages have been widely adopted for high-end applications such as datacenter, networking, and artificial intelligence. To meet the increasing demand for higher ...