New platform integrates multiphysics analysis across chip, package and photonic design workflows to support advanced semiconductor and multi-die systems. Synopsys has announced the availability of the ...

Abstract: This article proposes loss and thermally optimized copper and aluminum structures for automotive electrical machines. A first batch of multiphysics optimization is performed parametrically ...

Abstract: The aim of this paper is to calculate the inductance of a spiral planar coil. COMSOL Multiphysics software was used to calculate the inductance. The article describes the design of the ...

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