Discover how multiphysics modelling is transforming semiconductor design and manufacturing in this new three-part webinar series. Learn practical simulation techniques for device physics, packaging ...

Integrates golden signoff multiphysics analysis directly into timing signoff, design closure, multi-die, and analog workflows, enabling earlier, more accurate design decisions. Synopsys, Inc. has ...

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New platform integrates multiphysics analysis across chip, package and photonic design workflows to support advanced semiconductor and multi-die systems. Synopsys has announced the availability of the ...

Synopsys has announced availability of its first Multiphysics Fusion product for customer deployment. As chip complexity increases, physics-related challenges including signal integrity, power ...

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COMSOL Multiphysics version 6.4 accelerates engineering simulations and multiphysics models. Full GPU support across all physics delivers up to 5× speedups in benchmarks. COMSOL now supports GPU ...

Multiphysics simulation helps engineers understand the interaction of thermal, structural, acoustic, fluid, and electromagnetic effects in complex systems. Accurate material properties are crucial; ...

Abstract: In this paper, a multiphysics simulation of a high-power industrial IGBT module with a heatsink is presented. The model incorporates electrical, thermo-mechanical, and fluid domains to ...