New platform integrates multiphysics analysis across chip, package and photonic design workflows to support advanced semiconductor and multi-die systems. Synopsys has announced the availability of the ...

Abstract: This article introduces a novel multiphysics modeling framework for the high-fidelity simulation of superconductors in microwave. The proposed approach integrates the time-dependent Ginzburg ...

Abstract: This article proposes loss and thermally optimized copper and aluminum structures for automotive electrical machines. A first batch of multiphysics optimization is performed parametrically ...