Abstract: This work presents a high density single-ended NRZ Chiplet IO in 3nm CMOS technology over 2.5D CoWoS interposer of up to 2mm trace length, with a total of 216 data lanes running ...

Abstract: With the rapid advancement of artificial intelligence (AI), computing-in-memory (CIM) structure is proposed to improve energy efficiency (EF). However, previous CIMs often rely on INT8 data ...