An IIT Madras spinout believes a PCB’s non-conductive base made of epoxy resin & glass fibre can be replaced with ...

Solderless assembly processes eliminate solder joints and enable a more integrated, fabrication-like method of system ...

Abstract: Owing to its remarkable convenience, weak invasiveness, and strong private security, palmprint recognition has become one of the most promising biometric methods and has attracted increasing ...

Abstract: As a typical wide bandgap semiconductor device, Silicon carbide MOSFET is more suitable for high-frequency and high-voltage applications. However, its high-speed switching characteristics ...