High power density power-supply modules based on gallium nitride (GaN) devices are core components in the automotive, industrial and data-center sectors. As their integration level and power density ...

Abstract: The continuous advancement of semiconductor processes has led to increasingly prominent leakage power issues in integrated circuits (ICs), making leakage-aware nonlinear thermal simulation a ...

Abstract: Thermal management plays an increasingly important role in the design of 3-D integrated circuits (ICs) and packages. To deal with the related thermal issues, efficient and accurate ...

FLIR Systems ResearchIR 4.2 thermal imaging software provides researchers and scientists with a for viewing, acquiring, analysing, and sharing thermal data FLIR Systems ResearchIR 4.2 thermal imaging ...