The second round is now in the books! Thirty more players heard their names called, and now the real work starts. Summer league and training camps offer opportunities for everyone below to officially ...

Abstract: This work presents a high density single-ended NRZ Chiplet IO in 3nm CMOS technology over 2.5D CoWoS interposer of up to 2mm trace length, with a total of 216 data lanes running ...

Abstract: 2.5D silicon interposer packages have been widely adopted for high-end applications such as datacenter, networking, and artificial intelligence. To meet the increasing demand for higher ...